72g 50% Woodpulp Dust-Free SMT Wipe Paper Using in Semiconductor Assembly

• Customization: Available
• Type: Wood Rosin
• Grade: Special Grade
• Model NO.: QS-smt-0001
• Usage: Industrial, Paper Making, Instrument, Chinese Medicine
• Packaging: Bag
• Processing Method: Steam Method
• Color: White
• Transport Package: by Carton
• Specification: 72g, 80g
• Trademark: QS
• Origin: China
• HS Code: 4823909000
• Production Capacity: 20000 Rolls/ Day

Product Description

72G 50% Woodpulp Dust-free SMT Wipe Paper Using in Semiconductor Assembly

Style description:

Function: The raw material of this product is made of wood pulp and polyester through a spunlace
process. It has low dust and high water solubility. It is suitable for wiping the steel mesh of
SMT production line automatic printers, which can effectively remove residual solder paste
and adhesives. , Improve production efficiency and reduce scrap rate.

Performance characteristics:

1. Dust-free, no fiber falling off during use, no fiber debris, ensuring the quality of wiping;
2. Uniform net formation, with excellent vertical and horizontal tension;
3. The material is soft, does not produce any scratches on the surface of the cleaning
object, and does not damage the surface of the object.

Technical Parameter:

Item	Unit	Level A	Level B
Water absorption	ml/m.sq	>400	400-300
Cation content	ug/cm.sq	<0.01	0.01~0.05
Anion content	ug/cm.sq	<0.02	0.02~0,1
Number of particles L>0.5um	count/cm.sqNVR	<750	750-1500
Number of particles A>0.5um	count/cm.sq	<100	100-500

Applicable industry:

SMT production line/semiconductor assembly production line/optical products/PCB products/automobile/mobile phone production line/medical equipment.


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