Composite Cleanroom Wipe Lint-Free Clean Room Clean Wiper

• Certification: GS, RoHS, ISO, CE
• Type: Wipe, Clean Swap/Wipe
• Usage: SMT Production Line, Printing Workshop, Computer Room, Electronic Component Maintenance Room
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: CRW006
• Condition: New
• Waterproof: Non-Waterproof
• Material: Polyester
• Transport Package: Carton
• Specification: 4′′X4′′, 9′′X9′′, 12′′x12′′
• Trademark: OEM
• Origin: China
• HS Code: 5603929000
• Production Capacity: 10, 000bags/ Day
• Package Size: 50.00cm * 30.00cm * 40.00cm
• Package Gross Weight: 2.000kg

Product Description

Micro Fiber Double Compound Dust-Free Cleanroom Wiper

Product details

Material	55% cellulose 45% polyester
Weight	140gsm+/-10gsm
Color	White
Package	150pcs/bag
Size	4''X4'',9''X9'',12''x12''
Class	100-1000
Edge	Laser cut or Ultrasonic cut
Certificate	SGS Rosh ISO
OEM	Avaialble
Application	Cleanroom,electronic industry
Product Keywords	100%Polyester 140gsm+/-10gsm Ultrasonic Sealed Edge Clean Room Wiper

Advantage

1,The special process of shaping processing, so that the thickness of the cloth, gram weight, width, water absorption and feel to achieve the best effect;
2,The special treatment to improve the strength of the wiping cloth, durability;
3,Excellent edge sealing effect, minimize the dust generation of cloth edge;
4,Clean and pack in CLASS100 clean room;
5,Good wear resistance, suitable for a variety of chemical solvents;
6,Suitable for cleaning instruments, equipment and table.

Application environment:

- Cleaning and Polishing Stainless Steel Surface.
- Superior for spill control and general wiping in ISO Class 5 Cleanroom Facilities.
- Highest level of contamination control in critical processing applications.
- Oxidation, Metallization, CVD or Photolithography processes, medical device products, stencil and other print roll cleaning
applications, chamber cleaning and CMP processing.